![]() The new chipset also supports more USB 3.1 Gen2 ports (now at 8 compared to the previous generation’s 2) and can natively handle connectivity features such as Wi-Fi and Bluetooth. When compared to its predecessor, the 3700X has double the amount of 元 cache (32MB vs 16MB), a slightly lower base clock speed (3.6GHz vs 3.7GHz), a slightly higher boost clock speed (4.4GHz vs 4.3GHz), and a significantly lower TDP (65W vs 105W).ĪMD’s new X570 chipset, that works with the new Ryzen 3000 processors, are also the first consumer boards that support PCIe 4.0, which will lead to even faster NVMe SSDs with native raid support as well as other implementations such as more PCIe 4.0 NVMe M.2 slots, SATA ports, and more. ![]() It also features a base and boost clocks of 3.6GHz and 4.4GHz, respectively, and a TDP of only 65W. The main specifications of the new 3700X include eight cores and sixteen threads, a 32MB 元 cache, 24 PCIe lanes, and support dual-channel DDR4 memory up to 3200MHz. In the case of the consumer Ryzen series, from Ryzen 5 to Ryzen 9, the CCD is able to accommodate up to two CPU dies, from 6 cores using a single 6-core die all the way up to 16 cores using two 8-core dies. This allows the new Ryzen processors to be more scalable and leads to easier manufacturing as AMD is able to use the same CCD for different products. The new design separates the multiple CPU dies, which uses the 7nm process, from the I/O dies, that utilize the older 12nm process. While the Zen+ featured a slightly better manufacturing process from the original Zen, going from 14nm to 12nm, the third-generation processors are manufactured using a new 7nm process and features a completely new multi-chip package design. The new architecture is significantly bigger upgrade from last year’s Zen+, which was considered as only an incremental update to the original Zen architecture. The 3700X as well as all of the third-generation Ryzen processors are based on AMD’s latest Zen 2 architecture.
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